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Name： Solar Power Control PCB
Numbers：
Postdate：2013-01-20
Surface: ENIG
Laminate: Tg170
Layer: 8L
Inner copper layer: 3 OZ
Oute copper layer: 5 OZ
Board thikness: 3.2mm
Min VIA hole size: 0.3mm
Press fit hole tolerance: +/-0.05mm
Hi-Pot: 3000 VDC